How to deal with the risks in the iteration of electronic industry technology?

The iteration of electronic industry technology is indeed full of challenges, but we can systematically address them from these five key directions: 1、 Technical bottleneck: physical limits and material breakthroughs Chip process: 3nm mass production is approaching the physical limit, and breakthroughs in quantum tunneling effect are needed. 2nm/1nm research and development is key. Optoelectronic devices: The speed of optical modules is evolving towards Tb/s, and silicon-based optoelectronic fusion technology has become a breakthrough point. Material innovation: The localization rate of semiconductor materials and packaging materials is less than 30%, and we need to break through the bottleneck link. 2、 System Challenge: Software Definition and Ecological Refactoring Basic software: It is necessary to implement scene driven, application aware software definition, and software hardware collaboration. Industrial software: The adaptation challenge between the discreteness of system operation and the continuity of industrial systems is prominent. Ecological collaboration: The deep integration of technologies such as AI, IoT, and 5G requires the construction of a cross domain technology ecosystem. 3、 Security Challenge: Network Sovereignty and Electromagnetic Environment Network security: It is necessary to build a proactive defense barrier that is fast to attack and smart to smart. Electromagnetic environment: With the widespread application of technologies such as 5G and the Internet of Things, electromagnetic safety issues have become prominent. 4、 Application challenge: scenarization and greenization Scenario based requirements: Automotive electronics are evolving towards autonomous driving, and industrial electronic devices are transitioning towards intelligent manufacturing. Green Manufacturing: Environmental regulations promote the application of low-energy and low pollution technologies. 5、 Policy and Market Challenges Domestic substitution: The localization rate of semiconductor equipment, materials and other fields has increased, but the space for domestic substitution is still vast. International competition: Global technological innovation is intensive and active, with both technological and market barriers coexisting. Response strategy: Research first: Conduct thorough market research and technical analysis to clarify the application scenarios and risks of new technologies. Building an evaluation system: Based on industry characteristics, establish a maturity and performance evaluation system for intelligent manufacturing. Strengthen collaborative cooperation: Strengthen cooperation between upstream and downstream of the industrial chain, and support domestic enterprises' technological iteration. Increase R&D investment: Continuously break through industry common key technologies and cultivate new business growth points. Improve intellectual property protection: Strengthen the layout of domestic and foreign patents to avoid infringing on the intellectual property rights of others.